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为了满足功率日益增长的插箱印制板工作温度要求,采用“插箱框架通液+均温板插件模块”的液冷插箱散热形式。结合插箱外形、插件模块热耗分布要求,对插箱进行结构设计;分析插箱传热路径,基于插箱结构对内部流体流道进行优化设计,在满足流阻要求的情况下,局部采用扰流柱微小流道进行强化换热设计;最后通过热流仿真计算,验证液冷插箱的换热性能及流阻性能。仿真结果表明:该型液冷插箱散热性能良好,可实现单印制板插件模块140 W以上散热,插件散热壳体最高温度75℃。
Abstract:In order to meet the operating temperature requirements of subrack printed board with increasing power, the liquid cooling subrack cooling form of the liquid passing through subrack frame and the temperature equalization board plug-in module is adopted.According to the appearance of subrack and the heat consumption distribution requirements of the plug-in module, the subrack structure is designed.The heat transfer path of the subrack is analyzed, and the internal fluid flow is optimized based on the subrack structure.When the requirement of flow resistance is met, the spoiler micro-flow path is used to strengthen the heat transfer design locally.Finally, the heat transfer performance and flow resistance performance of the liquid cooling subrack are verified by heat flow simulation.The simulation results show that the cooling performance of the liquid cooling subrack is good, and the heat dissipation of a single printed board subrack module can be more than 140 W,and the maximum temperature of the plug-in cooling shell is 75 ℃.
[1] 李蔺.VITA48.1架构下VPX风冷插箱的研制[J].科技与创新,2023(3):40-43.
[2] 郝丙仁,谢馨,李慧利,等.一种空间受限大功率VPX机箱热设计与分析[J].电子器件,2023,46(6):1714-1719.
[3] 张新东,金旸霖,韩文静.某弹载电子机箱的热设计[J].机械与电子,2020,38(5):47-50.
[4] 李纪元,李金旺,周刘伟.不同扰流柱结构冷板传热性能研究[J].化工学报,2023,74(4):1474-1488.
[5] 张星.微小流道冷板换热性能研究[J].舰船电子对抗,2023,46(3):108-112.
[6] 朱雨,韦巍,郭柳柳,等.基于ICEPAK仿真的散热器结构热设计研究[J].电子机械工程,2019,50(5):34-37.
[7] 项立银,刘永超,张俊德,等.微小通道冷板流动传热仿真校核方法研究[J].计算机仿真,2024,41(2):354-358.
[8] 李汉林,谭公礼,陈君.某组合式冷板的结构设计及制造工艺[J].舰船电子对抗,2021,44(1):112-115.
[9] 朱家昌,张振越,郭鑫,等.大功率微系统的微流道结构散热特性研究[J].仿真建模与分析,2020,38(6):19-23.
[10] TANG A,LI J M,LOU L S,et al.Optimization design and numerical study on water cooling structure for power lithium battery pack[J].Applied Thermal Engineering,2019,159(12):113760.
[11] 谭公礼,吴学群,刘则良,等.飞行器高空下落散热数值模拟及试验研究[J].科学与技术工程,2018,18(29):120-126.
基本信息:
DOI:10.16426/j.cnki.jcdzdk.2024.04.020
中图分类号:TN41
引用信息:
[1]张岩,倪洪亮.液冷插箱设计及换热性能研究[J].舰船电子对抗,2024,47(04):112-116.DOI:10.16426/j.cnki.jcdzdk.2024.04.020.
基金信息: